METAL-BASED PACKAGE SUBSTRATE, THREE-DIMENSIONAL MULTI-LAYERED PACKAGE MODULE USING THE SAME, AND MANUFACTURING METHOD THEREOF금속 베이스 패키지 기판과 이를 이용한 3차원 다층 패키지모듈 및 그 제조방법

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A package substrate, a manufacturing method thereof, a base package module (200), and a multi-layered package module having package substrates (100a, 100b, 100c) laminated on upper and lower portions of a base package module (200) are provided. The base package module (200) includes a base metal substrate (40), a first metal oxide layer (44) that is formed on the base metal substrate to have a cavity (47) therein, a device (48) that is mounted in the cavity (47) on the base metal substrate (200) and insulated by the first metal oxide layer (44) formed on a sidewall in the cavity (47), and a conductor (50) that is connected to the device (48) and a wiring pad (61 ) formed on the first metal oxide layer (44) on the base metal substrate (200). The package substrate includes a wiring pad (61 ), a conductor line (50), a second metal oxide layer (18) having an opening (22) that exposes a device (48), and a via (20) that is connected to the wiring pad (61 ) through a connection pad (62) in the second metal oxide layer (18).
Assignee
Wavenics, Inc.,KAIST
Country
EI
Issue Date
2010-04-14
Application Date
2007-09-18
Application Number
07808277.3
Registration Date
2010-04-14
Registration Number
2174349
URI
http://hdl.handle.net/10203/232433
Appears in Collection
EE-Patent(특허)
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