Residual stress and deformation during rapid cooling process in an epoxy plate

Abstract

Residual stress in the epoxy plate during a rapid cooling process was measured by the layer removal method and calculated by the linear thermoviscoelastic theory considering specific volume relaxation. The relaxations of the tensile modulus and specific volume were measured by an Instron thermomechanical analyzer. When the starting transition temperature of the cured epoxy, the residual stress in the epoxy plate was smaller than when the starting temperature was higher than the glass transition temperature. However, the transient stress in the cured was near the glass transition temperature than when the starting temperature. The quenched epoxy plate was compressed in the direction parallel to the surface and expanded in the thickness direction.