Using the CESM Shell to Classify Wafer Defects from Visual Data
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Chi, Sungd-Do | - |
| dc.contributor.author | Zeigler, Bernard P. | - |
| dc.contributor.author | Kim, Tag-Gon | - |
| dc.date.accessioned | 2011-03-22T05:31:34Z | - |
| dc.date.available | 2011-03-22T05:31:34Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1989-11 | - |
| dc.identifier.citation | SPIE 89, v., no., pp.66 - 70 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/22879 | - |
| dc.description.sponsorship | The authors thank Prof. R. N. Strickland and Kyeong-Seop Kim for developing the low level image processing methodologies employed here and providing necessary visual data. | en |
| dc.language | ENG | - |
| dc.language.iso | en_US | en |
| dc.publisher | SPIE | - |
| dc.title | Using the CESM Shell to Classify Wafer Defects from Visual Data | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 66 | - |
| dc.citation.endingpage | 70 | - |
| dc.citation.publicationname | SPIE 89 | - |
| dc.identifier.conferencecountry | United States | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Kim, Tag-Gon | - |
| dc.contributor.nonIdAuthor | Chi, Sungd-Do | - |
| dc.contributor.nonIdAuthor | Zeigler, Bernard P. | - |
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