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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Power and Signal Integrity Analysis of Fan-out Wafer Level Package for Mobile Application Processor

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dc.contributor.authorKim, Jounghoko
dc.contributor.authorKim, Youngwooko
dc.contributor.authorCho, Kyungjunko
dc.contributor.authorPark, Gapyeolko
dc.contributor.authorKim, Subinko
dc.contributor.authorKang, Kibumko
dc.contributor.authorSo, Kwangsupko
dc.contributor.authorJeon, Jiwonko
dc.contributor.authorKim, Chungjuko
dc.contributor.authorPaik, Woohyunko
dc.date.accessioned2017-12-05T02:43:42Z-
dc.date.available2017-12-05T02:43:42Z-
dc.date.created2017-11-29-
dc.date.issued2017-01-31-
dc.identifier.citationDesignCon 2017-
dc.identifier.urihttp://hdl.handle.net/10203/227745-
dc.languageEnglish-
dc.publisherDesignCon 2017-
dc.titlePower and Signal Integrity Analysis of Fan-out Wafer Level Package for Mobile Application Processor-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameDesignCon 2017-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationSanta Clara Convention Center, Santa Clara, California-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorKim, Youngwoo-
dc.contributor.nonIdAuthorCho, Kyungjun-
dc.contributor.nonIdAuthorPark, Gapyeol-
dc.contributor.nonIdAuthorKim, Subin-
dc.contributor.nonIdAuthorKang, Kibum-
dc.contributor.nonIdAuthorSo, Kwangsup-
dc.contributor.nonIdAuthorJeon, Jiwon-
dc.contributor.nonIdAuthorKim, Chungju-
dc.contributor.nonIdAuthorPaik, Woohyun-
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EE-Conference Papers(학술회의논문)
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