Modeling, Measurement, and Analysis of TSV Channel and Defects for 2.5D/3D IC Failure Analysis
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Joungho | ko |
| dc.contributor.author | Jung, Daniel H | ko |
| dc.contributor.author | Bae, Hyun-Cheol | ko |
| dc.contributor.author | Choi, Kwang-Seong | ko |
| dc.contributor.author | Youn, Joong Suk | ko |
| dc.date.accessioned | 2017-12-05T02:43:41Z | - |
| dc.date.available | 2017-12-05T02:43:41Z | - |
| dc.date.created | 2017-11-29 | - |
| dc.date.issued | 2017-02-01 | - |
| dc.identifier.citation | DesignCon 2017 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/227744 | - |
| dc.language | English | - |
| dc.publisher | DesignCon 2017 | - |
| dc.title | Modeling, Measurement, and Analysis of TSV Channel and Defects for 2.5D/3D IC Failure Analysis | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | DesignCon 2017 | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Santa Clara Convention Center, Santa Clara, California | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Jung, Daniel H | - |
| dc.contributor.nonIdAuthor | Bae, Hyun-Cheol | - |
| dc.contributor.nonIdAuthor | Choi, Kwang-Seong | - |
| dc.contributor.nonIdAuthor | Youn, Joong Suk | - |
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