DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Youngwoo | ko |
dc.contributor.author | Cho, Jonghyun | ko |
dc.contributor.author | Cho, Kyungjun | ko |
dc.contributor.author | Park, Junyong | ko |
dc.contributor.author | Kim, Subin | ko |
dc.contributor.author | Kim, Dong-Hyun | ko |
dc.contributor.author | Park, Gapyeol | ko |
dc.contributor.author | Sitaraman, Srikrishna | ko |
dc.contributor.author | Raj, Pulugurtha Markondeya | ko |
dc.contributor.author | Tummala, Rao R. | ko |
dc.contributor.author | Kim, Joungho | ko |
dc.date.accessioned | 2017-11-08T02:22:54Z | - |
dc.date.available | 2017-11-08T02:22:54Z | - |
dc.date.created | 2017-10-23 | - |
dc.date.created | 2017-10-23 | - |
dc.date.created | 2017-10-23 | - |
dc.date.created | 2017-10-23 | - |
dc.date.issued | 2017-09 | - |
dc.identifier.citation | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.9, pp.1493 - 1505 | - |
dc.identifier.issn | 2156-3950 | - |
dc.identifier.uri | http://hdl.handle.net/10203/226726 | - |
dc.description.abstract | In this paper, we propose glass-interposer (GI) electromagnetic bandgap (EBG) structure with defected ground plane (DGP) for efficient and broadband suppression of power/ground noise coupling. We designed, fabricated, measured, and analyzed a GI-EBG structure with DGP for the first time. The proposed GI-EBG structure with DGP is thoroughly analyzed using the dispersion characteristics and estimated stopband edges, f(L) and f(U). We experimentally verified that the proposed GI-EBG structure with DGP achieved power/ground noise isolation bandgap (below -30 dB) between f(L) of 5.7 GHz and f(U) of 11 GHz. Estimation of f(L) and f(U) using dispersion analysis, full 3-D electromagnetic (EM) simulation results, and measurement results achieved good correlation. Effectiveness of the proposed GI-EBG structure with DGP on suppression of the power/ground noise coupling to high-speed through glass via (TGV) channel is verified with 3-D EM simulation. As a result, the proposed EBG structure successfully and efficiently suppressed the power/ground noise coupling and improved the eye diagram of the TGV channel. Lastly, we embedded thin alumina film in the proposed EBG structure and achieved even broader power/ground noise suppression between 2.1 and 14.7 GHz. | - |
dc.language | English | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.subject | SELECTIVE VALIDATION FSV | - |
dc.subject | DESIGN | - |
dc.subject | INTEGRATION | - |
dc.subject | SIZE | - |
dc.subject | CEM | - |
dc.title | Glass-Interposer Electromagnetic Bandgap Structure With Defected Ground Plane for Broadband Suppression of Power/Ground Noise Coupling | - |
dc.type | Article | - |
dc.identifier.wosid | 000412629000012 | - |
dc.identifier.scopusid | 2-s2.0-85029170313 | - |
dc.type.rims | ART | - |
dc.citation.volume | 7 | - |
dc.citation.issue | 9 | - |
dc.citation.beginningpage | 1493 | - |
dc.citation.endingpage | 1505 | - |
dc.citation.publicationname | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | - |
dc.identifier.doi | 10.1109/TCPMT.2017.2730853 | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Cho, Jonghyun | - |
dc.contributor.nonIdAuthor | Park, Gapyeol | - |
dc.contributor.nonIdAuthor | Sitaraman, Srikrishna | - |
dc.contributor.nonIdAuthor | Raj, Pulugurtha Markondeya | - |
dc.contributor.nonIdAuthor | Tummala, Rao R. | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Defected ground plane (DGP) | - |
dc.subject.keywordAuthor | electromagnetic bandgap (EBG) | - |
dc.subject.keywordAuthor | glass | - |
dc.subject.keywordAuthor | interposer | - |
dc.subject.keywordAuthor | power/ground noise | - |
dc.subject.keywordAuthor | through glass via (TGV) | - |
dc.subject.keywordPlus | SELECTIVE VALIDATION FSV | - |
dc.subject.keywordPlus | DESIGN | - |
dc.subject.keywordPlus | INTEGRATION | - |
dc.subject.keywordPlus | SIZE | - |
dc.subject.keywordPlus | CEM | - |
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