Special Issue on PCB Level Signal Integrity, Power Integrity, and EMC
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Joungho | ko |
| dc.contributor.author | Li, Erping | ko |
| dc.date.accessioned | 2017-10-23T02:40:07Z | - |
| dc.date.available | 2017-10-23T02:40:07Z | - |
| dc.date.created | 2017-10-17 | - |
| dc.date.created | 2017-10-17 | - |
| dc.date.created | 2017-10-17 | - |
| dc.date.issued | 2010-05 | - |
| dc.identifier.citation | IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.52, no.2, pp.246 - 247 | - |
| dc.identifier.issn | 0018-9375 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/226660 | - |
| dc.language | English | - |
| dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
| dc.title | Special Issue on PCB Level Signal Integrity, Power Integrity, and EMC | - |
| dc.type | Article | - |
| dc.identifier.wosid | 000277881800001 | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 52 | - |
| dc.citation.issue | 2 | - |
| dc.citation.beginningpage | 246 | - |
| dc.citation.endingpage | 247 | - |
| dc.citation.publicationname | IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY | - |
| dc.identifier.doi | 10.1109/TEMC.2010.2049073 | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Li, Erping | - |
| dc.description.isOpenAccess | N | - |
| dc.type.journalArticle | Editorial Material | - |
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