Analysis of Power Distribution Network in Glass, Silicon Interposer and PCB
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Joung-Ho | ko |
| dc.contributor.author | Kim, Youngwoo | ko |
| dc.contributor.author | Kim, Kiyeong | ko |
| dc.contributor.author | Cho, Jonghyun | ko |
| dc.contributor.author | Sundaram, Venky | ko |
| dc.contributor.author | Tummala, Rao | ko |
| dc.date.accessioned | 2017-10-23T02:33:33Z | - |
| dc.date.available | 2017-10-23T02:33:33Z | - |
| dc.date.created | 2014-11-26 | - |
| dc.date.created | 2014-11-26 | - |
| dc.date.created | 2014-11-26 | - |
| dc.date.issued | 2014-08-03 | - |
| dc.identifier.citation | 2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SI/PI) | - |
| dc.identifier.uri | http://hdl.handle.net/10203/226566 | - |
| dc.language | English | - |
| dc.publisher | 2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SI/PI) | - |
| dc.title | Analysis of Power Distribution Network in Glass, Silicon Interposer and PCB | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000393471300086 | - |
| dc.identifier.scopusid | 2-s2.0-84931824669 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 2014 IEEE International Symposium on Electromagnetic Compatibility(EMC&SI/PI) | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Raleigh Convention Center, Raleigh, NC | - |
| dc.contributor.localauthor | Kim, Joung-Ho | - |
| dc.contributor.nonIdAuthor | Kim, Youngwoo | - |
| dc.contributor.nonIdAuthor | Kim, Kiyeong | - |
| dc.contributor.nonIdAuthor | Cho, Jonghyun | - |
| dc.contributor.nonIdAuthor | Sundaram, Venky | - |
| dc.contributor.nonIdAuthor | Tummala, Rao | - |
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