DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yang, Jinyeol | ko |
dc.contributor.author | Hwang, Soonkyu | ko |
dc.contributor.author | Choi, Jaemook | ko |
dc.contributor.author | Sohn, Hoon | ko |
dc.date.accessioned | 2017-09-25T06:04:28Z | - |
dc.date.available | 2017-09-25T06:04:28Z | - |
dc.date.created | 2017-09-18 | - |
dc.date.created | 2017-09-18 | - |
dc.date.created | 2017-09-18 | - |
dc.date.created | 2017-09-18 | - |
dc.date.issued | 2017-04 | - |
dc.identifier.citation | JOURNAL OF THE KOREAN SOCIETY FOR NONDESTRUCTIVE TESTING, v.37, no.2, pp.106 - 114 | - |
dc.identifier.issn | 1225-7842 | - |
dc.identifier.uri | http://hdl.handle.net/10203/226163 | - |
dc.description.abstract | This paper presents an automated subsurface micro void detection technique based on pulsed infrared thermography for inspecting epoxy molding compounds (EMC) used in electronic device packaging. Subsurface micro voids are first detected and visualized by extracting a lock-in amplitude image from raw thermal images. Binary imaging follows to achieve better visualization of subsurface micro voids. A median filter is then applied for removing sparse noise components. The performance of the proposed technique is tested using 36 EMC samples, which have subsurface (below 150 mu m similar to 300 mu m from the inspection surface) micro voids (150 mu m similar to 300 mu m in diameter). The experimental results show that the subsurface micro voids can be successfully detected without causing any damage to the EMC samples, making it suitable for automated online inspection. | - |
dc.language | English | - |
dc.publisher | KOREAN SOC NONDESTRUCTIVE TESTING | - |
dc.title | Active Infrared Thermography for Visualizing Subsurface Micro Voids in an Epoxy Molding Compound | - |
dc.type | Article | - |
dc.type.rims | ART | - |
dc.citation.volume | 37 | - |
dc.citation.issue | 2 | - |
dc.citation.beginningpage | 106 | - |
dc.citation.endingpage | 114 | - |
dc.citation.publicationname | JOURNAL OF THE KOREAN SOCIETY FOR NONDESTRUCTIVE TESTING | - |
dc.identifier.doi | 10.7779/JKSNT.2017.37.2.106 | - |
dc.identifier.kciid | ART002221523 | - |
dc.contributor.localauthor | Sohn, Hoon | - |
dc.contributor.nonIdAuthor | Yang, Jinyeol | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Active Infrared Thermography | - |
dc.subject.keywordAuthor | Subsurface Micro Void Detection | - |
dc.subject.keywordAuthor | Baseline-Free Void Visualization | - |
dc.subject.keywordAuthor | Epoxy Molding Compound | - |
dc.subject.keywordAuthor | Extreme Value Statistics | - |
dc.subject.keywordAuthor | Binary Imaging | - |
dc.subject.keywordAuthor | Online Inspection | - |
dc.subject.keywordPlus | DEFECT | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.