A Study on Nano-sized Silica Content and Size Effect in Non Conductive Films (NCFs) for Ultra Fine-Pitch Cu-Pillar/Sn-Ag Micro-Bump Interconnection
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, HanMin | ko |
| dc.contributor.author | Lee, SeYong | ko |
| dc.contributor.author | Cho, SeMin | ko |
| dc.contributor.author | Park, Jong-Ho | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2017-05-25T06:03:26Z | - |
| dc.date.available | 2017-05-25T06:03:26Z | - |
| dc.date.created | 2017-05-15 | - |
| dc.date.issued | 2017-05-31 | - |
| dc.identifier.citation | 2017 IEEE 67th Electronic Components and Technology Conference | - |
| dc.identifier.uri | http://hdl.handle.net/10203/223721 | - |
| dc.language | English | - |
| dc.publisher | IEEE-CPMT | - |
| dc.title | A Study on Nano-sized Silica Content and Size Effect in Non Conductive Films (NCFs) for Ultra Fine-Pitch Cu-Pillar/Sn-Ag Micro-Bump Interconnection | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 2017 IEEE 67th Electronic Components and Technology Conference | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Walt Disney Swan & Dolphin, Orlando, FL | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Cho, SeMin | - |
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.