Modeling of through glass via(TGV) noise coupling and RF receiver performance degradation in glass interposers

Abstract

In 2.5D/3D ICs, through glass via(TGV) noise coupling could critically affect overall system’s performance. Therefore it is important to estimate exact noise coupling in glass interposers. Thus noise coupling modeling for glass interposer is needed. We proposed a TGV-TGV noise coupling model based on equivalent circuit model. Our TGV-TGV noise coupling structure for modeling verification is composed of TGVs and channel lines. So we proposed both TGV and channel line coupling model. We verified our model using meas-urement in frequency domain up to 20GHz by comparing the s-parameter. Also for reducing TGV-TGV noise coupling, noise coupling reduction methods are proposed and their effects are analyzed. In 2.5D/3D IC system design, TGV-TGV noise coupling can badly affect to glass in-terposer based RF system. RF system specification is specified with RF sensitivity. And RF sensitivity is dominantly determined by LNA noise figure. However general LNA noise figure doesn’t includes TGV-TGV noise coupling effects. Therefore we proposed modified LNA noise figure equation which includes coupling noise effect. Using modified noise figure equation, RF sensitivity can be calculated and noise coupling effect can be analyzed. Since noise coupling can affects to RF system’s target frequency, RF sensitivity standard can be violated. By estimating noise coupling effect, we can revise interposer design and RF receiver system can be well designed