Hybrid Surface Acoustic Wave-Electrohydrodynamic Atomization (SAW-EHDA) For the Development of Functional Thin Films

Abstract

Conventional surface acoustic wave - electrostatic deposition (SAW-ED) technology is struggling to compete with other thin film fabrication technologies because of its limitation in atomizing high density solutions or solutions with strong inter-particle bonding that requires very high frequency (100 MHz) and power. In this study, a hybrid surface acoustic wave - electrohydrodynamic atomization (SAW-EHDA) system has been introduced to overcome this problem by integrating EHDA with SAW to achieve the deposition of different types of conductive inks at lower frequency (19.8 MHZ) and power. Three materials, Poly [2-methoxy-5-(2-ethylhexyloxy)-1, 4-phenylenevinylene] (MEH-PPV), Zinc Oxide (ZnO), and Poly(3, 4-ethylenedioxythiophene): Polystyrene Sulfonate (PEDOT:PSS) have been successfully deposited as thin films through the hybrid SAW-EHDA. The films showed good morphological, chemical, electrical, and optical characteristics. To further evaluate the characteristics of deposited films, a humidity sensor was fabricated with active layer of PEDOT:PSS deposited using the SAW-EHDA system. The response of sensor was outstanding and much better when compared to similar sensors fabricated using other manufacturing techniques. The results of the device and the films' characteristics suggest that the hybrid SAW-EHDA technology has high potential to efficiently produce wide variety of thin films and thus predict its promising future in certain areas of printed electronics.