A thin film encapsulation fabricated via iCVD and ALD for its application to organic electronics

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dc.contributor.authorKim, Bong Junko
dc.contributor.authorPark, Hongkeunko
dc.contributor.authorKwon, Byoung-Hwako
dc.contributor.authorLee, Hyunkooko
dc.contributor.authorLee, Min Seokko
dc.contributor.authorKim, Doheungko
dc.contributor.authorLee, Jeong Ikko
dc.contributor.authorIm, Sung Gapko
dc.date.accessioned2017-01-03T09:06:19Z-
dc.date.available2017-01-03T09:06:19Z-
dc.date.created2016-11-30-
dc.date.issued2016-03-31-
dc.identifier.citation2016 MRS Spring Meeting & Exhibit-
dc.identifier.urihttp://hdl.handle.net/10203/215970-
dc.languageEnglish-
dc.publisherMRS(Materials Research Society)-
dc.titleA thin film encapsulation fabricated via iCVD and ALD for its application to organic electronics-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationname2016 MRS Spring Meeting & Exhibit-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationPhoenix Convention Center, Arizona-
dc.contributor.localauthorIm, Sung Gap-
dc.contributor.nonIdAuthorKwon, Byoung-Hwa-
dc.contributor.nonIdAuthorLee, Hyunkoo-
dc.contributor.nonIdAuthorLee, Min Seok-
dc.contributor.nonIdAuthorLee, Jeong Ik-
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CBE-Conference Papers(학술회의논문)
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