A thin film encapsulation fabricated via iCVD and ALD for its application to organic electronics
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Bong Jun | ko |
| dc.contributor.author | Park, Hongkeun | ko |
| dc.contributor.author | Kwon, Byoung-Hwa | ko |
| dc.contributor.author | Lee, Hyunkoo | ko |
| dc.contributor.author | Lee, Min Seok | ko |
| dc.contributor.author | Kim, Doheung | ko |
| dc.contributor.author | Lee, Jeong Ik | ko |
| dc.contributor.author | Im, Sung Gap | ko |
| dc.date.accessioned | 2017-01-03T09:06:19Z | - |
| dc.date.available | 2017-01-03T09:06:19Z | - |
| dc.date.created | 2016-11-30 | - |
| dc.date.issued | 2016-03-31 | - |
| dc.identifier.citation | 2016 MRS Spring Meeting & Exhibit | - |
| dc.identifier.uri | http://hdl.handle.net/10203/215970 | - |
| dc.language | English | - |
| dc.publisher | MRS(Materials Research Society) | - |
| dc.title | A thin film encapsulation fabricated via iCVD and ALD for its application to organic electronics | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 2016 MRS Spring Meeting & Exhibit | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Phoenix Convention Center, Arizona | - |
| dc.contributor.localauthor | Im, Sung Gap | - |
| dc.contributor.nonIdAuthor | Kwon, Byoung-Hwa | - |
| dc.contributor.nonIdAuthor | Lee, Hyunkoo | - |
| dc.contributor.nonIdAuthor | Lee, Min Seok | - |
| dc.contributor.nonIdAuthor | Lee, Jeong Ik | - |
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