PCB-package to Chip Wireless Power Transfer Scheme using Magnetic-field Resonance Coupling for High-density 3-D IC
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Song, Jinwook | ko |
| dc.contributor.author | Kim, Joungho | ko |
| dc.contributor.author | Jeong, Seungtaek | ko |
| dc.contributor.author | Park, Shinyoung | ko |
| dc.contributor.author | Kim, Jonghoon | ko |
| dc.contributor.author | Cho, Yeonje | ko |
| dc.date.accessioned | 2017-01-03T09:01:34Z | - |
| dc.date.available | 2017-01-03T09:01:34Z | - |
| dc.date.created | 2016-11-21 | - |
| dc.date.created | 2016-11-21 | - |
| dc.date.created | 2016-11-21 | - |
| dc.date.issued | 2016-05-05 | - |
| dc.identifier.citation | IEEE Wireless Power Transfer Conference 2016 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/215933 | - |
| dc.language | English | - |
| dc.publisher | IEEE Wireless Power Transfer Conference 2016 | - |
| dc.title | PCB-package to Chip Wireless Power Transfer Scheme using Magnetic-field Resonance Coupling for High-density 3-D IC | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000391251100006 | - |
| dc.identifier.scopusid | 2-s2.0-84979600215 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | IEEE Wireless Power Transfer Conference 2016 | - |
| dc.identifier.conferencecountry | PO | - |
| dc.identifier.conferencelocation | Universidade de Aveiro Campus Universitário Aveiro | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Song, Jinwook | - |
| dc.contributor.nonIdAuthor | Jeong, Seungtaek | - |
| dc.contributor.nonIdAuthor | Park, Shinyoung | - |
| dc.contributor.nonIdAuthor | Kim, Jonghoon | - |
| dc.contributor.nonIdAuthor | Cho, Yeonje | - |
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