Signal Integrity of Bump-less High-speed Through Silicon Via Channel for Terabyte/s Bandwidth 2.5D IC
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Hyunsuk | ko |
| dc.contributor.author | Kim, Joungho | ko |
| dc.contributor.author | Kim, Heegon | ko |
| dc.contributor.author | Choi, Sumin | ko |
| dc.contributor.author | Lim, Jaemin | ko |
| dc.contributor.author | Cho, Kyungjun | ko |
| dc.contributor.author | Jeon, Yeseul | ko |
| dc.date.accessioned | 2017-01-03T07:16:51Z | - |
| dc.date.available | 2017-01-03T07:16:51Z | - |
| dc.date.created | 2016-11-21 | - |
| dc.date.created | 2016-11-21 | - |
| dc.date.created | 2016-11-21 | - |
| dc.date.issued | 2016-05-31 | - |
| dc.identifier.citation | 66th Electronic Components and Technology Conference (ECTC) | - |
| dc.identifier.uri | http://hdl.handle.net/10203/215552 | - |
| dc.language | English | - |
| dc.publisher | 66th Electronic Components and Technology Conference (ECTC) | - |
| dc.title | Signal Integrity of Bump-less High-speed Through Silicon Via Channel for Terabyte/s Bandwidth 2.5D IC | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000386103500377 | - |
| dc.identifier.scopusid | 2-s2.0-84987835371 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 66th Electronic Components and Technology Conference (ECTC) | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Cosmopolitan Hotel of Las Vegas | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Lee, Hyunsuk | - |
| dc.contributor.nonIdAuthor | Kim, Heegon | - |
| dc.contributor.nonIdAuthor | Choi, Sumin | - |
| dc.contributor.nonIdAuthor | Lim, Jaemin | - |
| dc.contributor.nonIdAuthor | Cho, Kyungjun | - |
| dc.contributor.nonIdAuthor | Jeon, Yeseul | - |
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