Characterization of mechanical properties of Cu thin films by employing micro-tensile test and nanoindentation test

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dc.contributor.author김경섭-
dc.contributor.author한준희-
dc.contributor.author김영무-
dc.contributor.author홍순형-
dc.date.accessioned2016-10-13T02:43:22Z-
dc.date.available2016-10-13T02:43:22Z-
dc.date.created2016-08-28-
dc.date.issued2003-04-25-
dc.identifier.citationSpring Meeting of The Korean Institute of Metals and Materials, pp.13 - 13-
dc.identifier.urihttp://hdl.handle.net/10203/213397-
dc.languageKorean-
dc.publisher대한금속재료학회-
dc.titleCharacterization of mechanical properties of Cu thin films by employing micro-tensile test and nanoindentation test-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.beginningpage13-
dc.citation.endingpage13-
dc.citation.publicationnameSpring Meeting of The Korean Institute of Metals and Materials-
dc.identifier.conferencecountryKO-
dc.identifier.conferencelocation안동대학교-
dc.contributor.localauthor김영무-
dc.contributor.localauthor홍순형-
dc.contributor.nonIdAuthor김경섭-
dc.contributor.nonIdAuthor한준희-
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MS-Conference Papers(학술회의논문)
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