The Influence of Sequence Plasma Treatment Conditions on Peel Strength of Cu-Ni Clad in SAB (Surface Activated Bonding)

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Publisher
대한금속재료학회
Issue Date
2010-04-22
Language
Korean
Citation

Meeting of the Korean Institute of Metals and Materials, pp.135 - 135

URI
http://hdl.handle.net/10203/213386
Appears in Collection
MS-Conference Papers(학술회의논문)
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