haracterization of Interface Bond Strength and Microstructure of Cu Composite

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 242
  • Download : 0
Publisher
대한금속재료학회
Issue Date
2010-04-22
Language
Korean
Citation

Spring Meeting of the Korean Institute of Metals and Materials, pp.245 - 245

URI
http://hdl.handle.net/10203/213344
Appears in Collection
MS-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0