DC Field | Value | Language |
---|---|---|
dc.contributor.author | Woo, Seung A. | ko |
dc.contributor.author | Choi, Soo Young | ko |
dc.contributor.author | Kim, Jin-Baek | ko |
dc.date.accessioned | 2016-09-07T01:04:24Z | - |
dc.date.available | 2016-09-07T01:04:24Z | - |
dc.date.created | 2016-08-08 | - |
dc.date.created | 2016-08-08 | - |
dc.date.issued | 2016-08 | - |
dc.identifier.citation | POLYMER, v.98, pp.336 - 343 | - |
dc.identifier.issn | 0032-3861 | - |
dc.identifier.uri | http://hdl.handle.net/10203/212459 | - |
dc.description.abstract | Silicon-containing photoresists are gaining increasing interest for bilayer resist systems due to their high oxygen plasma resistance. Bilayer resist materials based on a nonchemically amplified resist system were prepared by copolymerization of polyhedral oligomeric silsesquioxane (POSS)-containing monomer, 2( 2-diazo-3-oxobutyryloxy) ethyl methacrylate (DOBEMA), 2-hydroxyethyl methacrylate (HEMA) and styrene. A series of POSS-containing resists with varying POSS contents were synthesized to optimize the dry etch resistance and selectivity. Upon UV irradiation, the resist film produced high resolution negative tone patterns. A bilayer pattern can be fabricated readily by pattern transfer of a thin silicon-containing top layer into a thick crosslinked organic bottom layer by anisotropic O-2 reactive ion etching. Finally, potential of the POSS-containing resist as an etch mask has been established by successful transfer of patterns into a silicon substrate through dry etching in CF4/O-2 plasma. (C) 2016 Published by Elsevier Ltd | - |
dc.language | English | - |
dc.publisher | ELSEVIER SCI LTD | - |
dc.subject | NEGATIVE-TYPE PHOTORESISTS | - |
dc.subject | THERMAL-PROPERTIES | - |
dc.subject | POSS | - |
dc.subject | NANOCOMPOSITES | - |
dc.subject | COPOLYMERS | - |
dc.subject | LITHOGRAPHY | - |
dc.title | Non-chemically amplified resists containing polyhedral oligomeric silsesquioxane for a bilayer resist system | - |
dc.type | Article | - |
dc.identifier.wosid | 000379679200038 | - |
dc.identifier.scopusid | 2-s2.0-84976444930 | - |
dc.type.rims | ART | - |
dc.citation.volume | 98 | - |
dc.citation.beginningpage | 336 | - |
dc.citation.endingpage | 343 | - |
dc.citation.publicationname | POLYMER | - |
dc.identifier.doi | 10.1016/j.polymer.2016.06.034 | - |
dc.contributor.localauthor | Kim, Jin-Baek | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Organic-inorganic hybrid material | - |
dc.subject.keywordAuthor | POSS-containing resist | - |
dc.subject.keywordAuthor | Non-chemically amplified resist | - |
dc.subject.keywordAuthor | Bilayer resist | - |
dc.subject.keywordAuthor | Pattern transfer | - |
dc.subject.keywordPlus | NEGATIVE-TYPE PHOTORESISTS | - |
dc.subject.keywordPlus | THERMAL-PROPERTIES | - |
dc.subject.keywordPlus | POSS | - |
dc.subject.keywordPlus | NANOCOMPOSITES | - |
dc.subject.keywordPlus | COPOLYMERS | - |
dc.subject.keywordPlus | LITHOGRAPHY | - |
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