외팔보 구조체를 이용한 나노미터 두께 스케일의 화학기상증착 박막의 스트레스를 측정하는 방법론Measurement methodology for residual stress of nano-meter thickness scale CVD film by using micro-cantilever deflection

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We report on methodology for measuring residual stress of nano-meter thickness scale CVD film by using micro-cantilever deflection. In this methodology, cantilever pairs of bilayer and monolayer cantilevers were fabricated simultaneously. In order to coat film of interest only onto the top of the bilayer cantilever, it was deposited before cantilever releasing process. Also, protective PR layer was adopted to keep film of interest from high temperature and chemically reactive environments. Deflection difference between bilayer and monolayer cantilevers was transformed into residual stress of film by using Stoney’s equation. By using this method, we measured stress of PECVD SiNx of 20nm thickness and it was 282.22MPa on average with standard deviation of 48.61MPa.
Publisher
마이크로나노시스템학회
Issue Date
2015-04-03
Language
Korean
Citation

제17회 한국MEMS학술대회

URI
http://hdl.handle.net/10203/211095
Appears in Collection
EE-Conference Papers(학술회의논문)
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