DC Field | Value | Language |
---|---|---|
dc.contributor.author | Zhang, Shuye | ko |
dc.contributor.author | Paik, Kyung Wook | ko |
dc.date.accessioned | 2016-07-06T04:36:46Z | - |
dc.date.available | 2016-07-06T04:36:46Z | - |
dc.date.created | 2016-06-15 | - |
dc.date.created | 2016-06-15 | - |
dc.date.issued | 2016-06-02 | - |
dc.identifier.citation | IEEE 66th Electronic Components and Technology Conference, pp.737 - 742 | - |
dc.identifier.uri | http://hdl.handle.net/10203/209588 | - |
dc.description.abstract | The effects of cooling processes of the hot bar lift-up time and the silica filler content of solder ACFs polymer resin on the crack formation at SnBi58 solder ACFs joint were investigated to obtain higher solder ACFs joint reliability. As a summary, complete removal of the solder crack at acrylic based ACF joints could be obtained by delaying hot bar lift-up time, until the temperature was cooled below the glass transition temperature of acrylic resin during cooling process, or adding more than 10 wt% of silica filler content into acrylic resins. Moreover, very reliable solder joint morphology and stable joint contact resistance were obtained after 1000 cycles T/C reliability due to removing solder cracks completely. | - |
dc.language | English | - |
dc.publisher | IEEE 66th Electronic Components and Technology Conference | - |
dc.title | Effects of Cooling Processes and Silica Filler Contents of Solder ACFs (Anisotropic Conductive Films) on the Joints Reliability | - |
dc.title.alternative | Effects of Cooling Processes and Silica Filler Contents of Solder ACFs (Anisotropic Conductive Films) on the Joints Reliability | - |
dc.type | Conference | - |
dc.identifier.wosid | 000386103500109 | - |
dc.identifier.scopusid | 2-s2.0-84987827443 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 737 | - |
dc.citation.endingpage | 742 | - |
dc.citation.publicationname | IEEE 66th Electronic Components and Technology Conference | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Cosmopolitan Hotel of Las Vegas | - |
dc.identifier.doi | 10.1109/ECTC.2016.152 | - |
dc.contributor.localauthor | Paik, Kyung Wook | - |
dc.contributor.nonIdAuthor | Zhang, Shuye | - |
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