DC Field | Value | Language |
---|---|---|
dc.contributor.author | Sim, Gidong | ko |
dc.contributor.author | Park, Jun-Hyub | ko |
dc.contributor.author | Uchic, Michael D. | ko |
dc.contributor.author | Shade, Paul A. | ko |
dc.contributor.author | Lee, Soon-Bok | ko |
dc.contributor.author | Vlassak, Joost J. | ko |
dc.date.accessioned | 2016-07-06T04:27:48Z | - |
dc.date.available | 2016-07-06T04:27:48Z | - |
dc.date.created | 2013-12-27 | - |
dc.date.created | 2013-12-27 | - |
dc.date.issued | 2013-11 | - |
dc.identifier.citation | ACTA MATERIALIA, v.61, no.19, pp.7500 - 7510 | - |
dc.identifier.issn | 1359-6454 | - |
dc.identifier.uri | http://hdl.handle.net/10203/209575 | - |
dc.description.abstract | In this paper, we introduce an apparatus to perform microtensile tests at elevated temperatures inside a scanning electron microscope. The apparatus has a stroke of 250 pm with a displacement resolution of 10 nm and a load resolution of 9.7 mu N. Measurements at elevated temperatures are performed through use of two silicon-based micromachined heaters that support the sample. Each heater consists of a tungsten heating element that also serves as a temperature gauge. To demonstrate the testing capabilities, tensile tests were performed on submicron Cu films at various temperatures up to 430 degrees C. Stress-strain curves show a significant decrease in yield strength and initial slope for the samples tested at elevated temperature, which we attribute to diffusion-facilitated grain boundary sliding and dislocation climb. | - |
dc.language | English | - |
dc.publisher | PERGAMON-ELSEVIER SCIENCE LTD | - |
dc.subject | FREESTANDING THIN-FILMS | - |
dc.subject | COPPER-FILMS | - |
dc.subject | MECHANICAL-PROPERTIES | - |
dc.subject | GRAIN-BOUNDARY | - |
dc.subject | FATIGUE BEHAVIOR | - |
dc.subject | LENGTH-SCALE | - |
dc.subject | CU FILMS | - |
dc.subject | SIZE | - |
dc.subject | PLASTICITY | - |
dc.subject | TENSILE | - |
dc.title | An apparatus for performing microtensile tests at elevated temperatures inside a scanning electron microscope | - |
dc.type | Article | - |
dc.identifier.wosid | 000327683700044 | - |
dc.identifier.scopusid | 2-s2.0-84885845336 | - |
dc.type.rims | ART | - |
dc.citation.volume | 61 | - |
dc.citation.issue | 19 | - |
dc.citation.beginningpage | 7500 | - |
dc.citation.endingpage | 7510 | - |
dc.citation.publicationname | ACTA MATERIALIA | - |
dc.identifier.doi | 10.1016/j.actamat.2013.08.064 | - |
dc.contributor.localauthor | Sim, Gidong | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.contributor.nonIdAuthor | Park, Jun-Hyub | - |
dc.contributor.nonIdAuthor | Uchic, Michael D. | - |
dc.contributor.nonIdAuthor | Shade, Paul A. | - |
dc.contributor.nonIdAuthor | Vlassak, Joost J. | - |
dc.description.isOpenAccess | N | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | In situ tension test | - |
dc.subject.keywordAuthor | High-temperature deformation | - |
dc.subject.keywordAuthor | Thin film | - |
dc.subject.keywordAuthor | Grain boundary sliding | - |
dc.subject.keywordAuthor | Creep | - |
dc.subject.keywordPlus | FREESTANDING THIN-FILMS | - |
dc.subject.keywordPlus | COPPER-FILMS | - |
dc.subject.keywordPlus | MECHANICAL-PROPERTIES | - |
dc.subject.keywordPlus | GRAIN-BOUNDARY | - |
dc.subject.keywordPlus | FATIGUE BEHAVIOR | - |
dc.subject.keywordPlus | LENGTH-SCALE | - |
dc.subject.keywordPlus | CU FILMS | - |
dc.subject.keywordPlus | SIZE | - |
dc.subject.keywordPlus | PLASTICITY | - |
dc.subject.keywordPlus | TENSILE | - |
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