Carbon Dioxide Sensor Substrate for Surface-mounted Packaging

Abstract

Solid state electrochemical and chemo-resistive gas sensors have been used widely but can operate only under high temperature. For reducing the power consumption and optimizing the structure of the substrate of these sensors, we conducted device and circuit simulations using the COMSOL Multiphysics simulator. For assessing the effective types of substrate and heat isolation, we conducted three-dimensional thermal simulations in two separate parts; (a) by changing the shape of the contacting holes and (b) punching additional holes on the substrate. Thus, it was possible to achieve high temperature in the sensor end of the substrate while maintaining low power consumption, and temperature in the circuit.