Bendable integrated circuits on plastic substrates by use of printed ribbons of single-crystalline silicon

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dc.contributor.authorLee, Keonjae-
dc.contributor.authorAhn, Jong-Hyun-
dc.contributor.authorZhu, Zhengtao-
dc.contributor.authorMenard, Etienne-
dc.contributor.authorKim, Dae-Hyeong-
dc.contributor.authorRogers, John A-
dc.contributor.authorKim, Hoon-Sik-
dc.contributor.authorNuzzo, Ralph G-
dc.date.accessioned2010-12-06T07:21:06Z-
dc.date.available2010-12-06T07:21:06Z-
dc.date.created2012-02-06-
dc.date.issued2007-05-
dc.identifier.citationAPPLIED PHYSICS LETTERS, v.90, no.21, pp.1 - 3-
dc.identifier.issn0003-6951-
dc.identifier.urihttp://hdl.handle.net/10203/20765-
dc.description.abstractThis letter presents studies of several simple integrated circuits-n-channel metal-oxide semiconductor inverters, five-stage ring oscillators, and differential amplifiers-formed on thin, bendable plastic substrates with printed ribbons of ultrathin single-crystalline silicon as the semiconductor. The inverters exhibit gains as high as 2.5, the ring oscillators operate with oscillation frequencies between 8 and 9 MHz at low supply voltages (similar to 4 V), and the differential amplifiers show good performance and voltage gains of 1.3 for 500 mV input signals. The responses of these systems to bending-induced strains show that relatively moderate changes of individual transistors can be significant for the operation of circuits that incorporate many transistors.-
dc.description.sponsorshipThis work was supported by the Department of Energy DEFG02-91ER45439 and used the Center for Microanalysis of Materials of the Frederick Seitz Materials Research Laboratory supported by the Department of Energy DEFG02-91ER45439. Work in developing the differential amplifiers was partially supported by NextGen Aeronautics under Department of Defense Small Business Research Innovation Program W31P4Q-05–C0308.en
dc.languageENG-
dc.language.isoen_USen
dc.publisherAmer Inst Physics-
dc.titleBendable integrated circuits on plastic substrates by use of printed ribbons of single-crystalline silicon-
dc.typeArticle-
dc.type.rimsART-
dc.citation.volume90-
dc.citation.issue21-
dc.citation.beginningpage1-
dc.citation.endingpage3-
dc.citation.publicationnameAPPLIED PHYSICS LETTERS-
dc.contributor.nonIdAuthorLee, Keonjae-
dc.contributor.nonIdAuthorAhn, Jong-Hyun-
dc.contributor.nonIdAuthorZhu, Zhengtao-
dc.contributor.nonIdAuthorMenard, Etienne-
dc.contributor.nonIdAuthorKim, Dae-Hyeong-
dc.contributor.nonIdAuthorRogers, John A-
dc.contributor.nonIdAuthorKim, Hoon-Sik-
dc.contributor.nonIdAuthorNuzzo, Ralph G-

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