DC Field | Value | Language |
---|---|---|
dc.contributor.author | Choi, Pyuck-Pa | ko |
dc.contributor.author | Al-Kassab, Talaat | ko |
dc.contributor.author | Kirchheim, Reiner | ko |
dc.date.accessioned | 2016-05-10T08:33:08Z | - |
dc.date.available | 2016-05-10T08:33:08Z | - |
dc.date.created | 2016-02-11 | - |
dc.date.created | 2016-02-11 | - |
dc.date.issued | 2005-08 | - |
dc.identifier.citation | SCRIPTA MATERIALIA, v.53, no.3, pp.323 - 327 | - |
dc.identifier.issn | 1359-6462 | - |
dc.identifier.uri | http://hdl.handle.net/10203/207137 | - |
dc.description.abstract | Sputter-deposited Al-2at.%Cu layers have been investigated with respect to their microstructure and the spatial distribution of the elements using the tomographic atom probe. Al grains show columnar shape in the as-sputtered state, where the matrix is supersaturated with Cu. Upon annealing at temperatures between 150 and 350 degrees C, a significant decrease in the average Cu concentration is measured within the grains. Neither second phase formation within the Al matrix nor Cu enrichment at the surface or at the layer/ substrate interface have been detected, suggesting segregation of Cu atoms in Al grain boundaries. (c) 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved. | - |
dc.language | English | - |
dc.publisher | PERGAMON-ELSEVIER SCIENCE LTD | - |
dc.subject | CU THIN-FILMS | - |
dc.subject | AL-CU | - |
dc.subject | PRECIPITATION | - |
dc.subject | ELECTROMIGRATION | - |
dc.subject | ALUMINUM | - |
dc.subject | COPPER | - |
dc.subject | DISSOLUTION | - |
dc.subject | SEGREGATION | - |
dc.subject | DIFFUSION | - |
dc.subject | KINETICS | - |
dc.title | Investigation of sputter-deposited Al-2at.%Cu layers by means of the tomographic atom probe (TAP) | - |
dc.type | Article | - |
dc.identifier.wosid | 000229958500011 | - |
dc.identifier.scopusid | 2-s2.0-18844435727 | - |
dc.type.rims | ART | - |
dc.citation.volume | 53 | - |
dc.citation.issue | 3 | - |
dc.citation.beginningpage | 323 | - |
dc.citation.endingpage | 327 | - |
dc.citation.publicationname | SCRIPTA MATERIALIA | - |
dc.identifier.doi | 10.1016/j.scriptamat.2005.04.008 | - |
dc.contributor.localauthor | Choi, Pyuck-Pa | - |
dc.contributor.nonIdAuthor | Al-Kassab, Talaat | - |
dc.contributor.nonIdAuthor | Kirchheim, Reiner | - |
dc.type.journalArticle | Article | - |
dc.subject.keywordAuthor | Al-Cu alloys | - |
dc.subject.keywordAuthor | sputtering | - |
dc.subject.keywordAuthor | nanocrystalline materials | - |
dc.subject.keywordAuthor | grain boundary segregation | - |
dc.subject.keywordAuthor | atom-probe field-ion microscopy (AP-FIM) | - |
dc.subject.keywordPlus | CU THIN-FILMS | - |
dc.subject.keywordPlus | AL-CU | - |
dc.subject.keywordPlus | PRECIPITATION | - |
dc.subject.keywordPlus | ELECTROMIGRATION | - |
dc.subject.keywordPlus | ALUMINUM | - |
dc.subject.keywordPlus | COPPER | - |
dc.subject.keywordPlus | DISSOLUTION | - |
dc.subject.keywordPlus | SEGREGATION | - |
dc.subject.keywordPlus | DIFFUSION | - |
dc.subject.keywordPlus | KINETICS | - |
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