Thermal stability of electrodeposited nanocrystalline Co-1.1at.%P

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dc.contributor.authorChoi, Pyuck-Pako
dc.contributor.authorda Silva, Mko
dc.contributor.authorKlement, Uko
dc.contributor.authorAl-Kassab, Tko
dc.contributor.authorKirchheim, Rko
dc.date.accessioned2016-05-10T08:32:58Z-
dc.date.available2016-05-10T08:32:58Z-
dc.date.created2016-02-05-
dc.date.created2016-02-05-
dc.date.issued2005-09-
dc.identifier.citationACTA MATERIALIA, v.53, no.16, pp.4473 - 4481-
dc.identifier.issn1359-6454-
dc.identifier.urihttp://hdl.handle.net/10203/207136-
dc.description.abstractNanocrystalline Co-1.lat.%P prepared by pulsed electrodeposition was investigated with respect to thermal stability. Several characterization methods such as differential scanning calorimetry, X-ray diffraction, transmission electron microscopy, field ion microscopy and tomographic atom probe were applied. Between 673 and 733 K, the allotropic phase transformation (hcp-Co to fcc-Co) sets in and abnormal grain growth is observed. It is suggested that there is a synergistic effect between abnormal grain growth and the allotropic phase transformation. Between 733 and 753 K, the P excess of the grain boundaries decreases, CO2P and CoP precipitates form, and normal grain growth occurs. Thus, the P-segregation to the grain boundaries is held responsible for the increased thermal stability of Co-1.lat.%P at temperatures below 753 K. The thermal stability of this alloy can be mainly attributed to the reduction of grain-boundary energy. (c) 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved-
dc.languageEnglish-
dc.publisherPERGAMON-ELSEVIER SCIENCE LTD-
dc.subjectTOMOGRAPHIC ATOM-PROBE-
dc.subjectGRAIN-BOUNDARY MOTION-
dc.subjectNI-3.6 AT.PERCENT P-
dc.subjectNI-P-
dc.subjectGROWTH-
dc.subjectNICKEL-
dc.subjectCOBALT-
dc.subjectALLOY-
dc.subjectTRANSFORMATION-
dc.subjectSEGREGATION-
dc.titleThermal stability of electrodeposited nanocrystalline Co-1.1at.%P-
dc.typeArticle-
dc.identifier.wosid000231793700017-
dc.identifier.scopusid2-s2.0-24044513277-
dc.type.rimsART-
dc.citation.volume53-
dc.citation.issue16-
dc.citation.beginningpage4473-
dc.citation.endingpage4481-
dc.citation.publicationnameACTA MATERIALIA-
dc.identifier.doi10.1016/j.actamat.2005.06.006-
dc.contributor.localauthorChoi, Pyuck-Pa-
dc.contributor.nonIdAuthorda Silva, M-
dc.contributor.nonIdAuthorKlement, U-
dc.contributor.nonIdAuthorAl-Kassab, T-
dc.contributor.nonIdAuthorKirchheim, R-
dc.type.journalArticleArticle-
dc.subject.keywordAuthornanocrystalline materials-
dc.subject.keywordAuthorCo-P alloy-
dc.subject.keywordAuthorsegregation-
dc.subject.keywordAuthorthermal stability-
dc.subject.keywordAuthorgrain growth-
dc.subject.keywordPlusTOMOGRAPHIC ATOM-PROBE-
dc.subject.keywordPlusGRAIN-BOUNDARY MOTION-
dc.subject.keywordPlusNI-3.6 AT.PERCENT P-
dc.subject.keywordPlusNI-P-
dc.subject.keywordPlusGROWTH-
dc.subject.keywordPlusNICKEL-
dc.subject.keywordPlusCOBALT-
dc.subject.keywordPlusALLOY-
dc.subject.keywordPlusTRANSFORMATION-
dc.subject.keywordPlusSEGREGATION-
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