DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Jae Han | - |
dc.contributor.author | Jang, KR | - |
dc.contributor.author | Jung, SB | - |
dc.contributor.author | Kim, Taek Soo | - |
dc.date.accessioned | 2016-04-18T05:52:59Z | - |
dc.date.available | 2016-04-18T05:52:59Z | - |
dc.date.created | 2015-12-15 | - |
dc.date.issued | 2015-09 | - |
dc.identifier.citation | 17th International Conference on Electronics Materials and Packaging, v., no., pp. - | - |
dc.identifier.uri | http://hdl.handle.net/10203/204797 | - |
dc.language | ENG | - |
dc.publisher | EMAP | - |
dc.title | Adhesion Characteristics of Screen-printed Ag Nanopaste Thin Films | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 17th International Conference on Electronics Materials and Packaging | - |
dc.identifier.conferencecountry | United States | - |
dc.identifier.conferencecountry | United States | - |
dc.contributor.localauthor | Kim, Jae Han | - |
dc.contributor.localauthor | Kim, Taek Soo | - |
dc.contributor.nonIdAuthor | Jang, KR | - |
dc.contributor.nonIdAuthor | Jung, SB | - |
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