Measurement of Hygroscopic Properties and Prediction of Moisture-Induced Warpage for Flexible Packaging Substrates

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dc.contributor.author표재범ko
dc.contributor.author이태익ko
dc.contributor.author김철규ko
dc.contributor.author김민성ko
dc.contributor.author김택수ko
dc.date.accessioned2016-04-18T05:50:58Z-
dc.date.available2016-04-18T05:50:58Z-
dc.date.created2015-12-15-
dc.date.issued2015-09-18-
dc.identifier.citationMicrojoining and Packaging Committee (MPC) 2015 Autumn Symposium-
dc.identifier.urihttp://hdl.handle.net/10203/204775-
dc.languageKorean-
dc.publisherMicrojoining and Packaging Committee-
dc.titleMeasurement of Hygroscopic Properties and Prediction of Moisture-Induced Warpage for Flexible Packaging Substrates-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameMicrojoining and Packaging Committee (MPC) 2015 Autumn Symposium-
dc.identifier.conferencecountryKO-
dc.identifier.conferencelocation한국과학기술회관, 서울-
dc.contributor.localauthor김택수-
dc.contributor.nonIdAuthor표재범-
dc.contributor.nonIdAuthor김민성-
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ME-Conference Papers(학술회의논문)
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