DC Field | Value | Language |
---|---|---|
dc.contributor.author | 표재범 | ko |
dc.contributor.author | 이태익 | ko |
dc.contributor.author | 김철규 | ko |
dc.contributor.author | 김민성 | ko |
dc.contributor.author | 김택수 | ko |
dc.date.accessioned | 2016-04-18T05:50:58Z | - |
dc.date.available | 2016-04-18T05:50:58Z | - |
dc.date.created | 2015-12-15 | - |
dc.date.issued | 2015-09-18 | - |
dc.identifier.citation | Microjoining and Packaging Committee (MPC) 2015 Autumn Symposium | - |
dc.identifier.uri | http://hdl.handle.net/10203/204775 | - |
dc.language | Korean | - |
dc.publisher | Microjoining and Packaging Committee | - |
dc.title | Measurement of Hygroscopic Properties and Prediction of Moisture-Induced Warpage for Flexible Packaging Substrates | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | Microjoining and Packaging Committee (MPC) 2015 Autumn Symposium | - |
dc.identifier.conferencecountry | KO | - |
dc.identifier.conferencelocation | 한국과학기술회관, 서울 | - |
dc.contributor.localauthor | 김택수 | - |
dc.contributor.nonIdAuthor | 표재범 | - |
dc.contributor.nonIdAuthor | 김민성 | - |
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