Study on Bending Feasibility and Joint Reliability for Fine Pitch Flex-on-Flex (FOF) Assembly using Nanofiber Solder Anisotropic Conductive Films (ACFs) and Ultrasonic (US) Bonding
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Tae Wan | ko |
| dc.contributor.author | Lee, Tae Ik | ko |
| dc.contributor.author | Lee, Sang Hoon | ko |
| dc.contributor.author | Kim, Taek Soo | ko |
| dc.contributor.author | Paik, Kyung Wook | ko |
| dc.date.accessioned | 2016-04-18T05:50:30Z | - |
| dc.date.available | 2016-04-18T05:50:30Z | - |
| dc.date.created | 2015-11-26 | - |
| dc.date.issued | 2015-10-14 | - |
| dc.identifier.citation | The 14th International Symposium on Microelectronics and Packaging | - |
| dc.identifier.uri | http://hdl.handle.net/10203/204770 | - |
| dc.language | English | - |
| dc.publisher | The Korean Microelectronics and Packaging Society | - |
| dc.title | Study on Bending Feasibility and Joint Reliability for Fine Pitch Flex-on-Flex (FOF) Assembly using Nanofiber Solder Anisotropic Conductive Films (ACFs) and Ultrasonic (US) Bonding | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | The 14th International Symposium on Microelectronics and Packaging | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | KINTEX Hall2, Ilsan | - |
| dc.contributor.localauthor | Kim, Taek Soo | - |
| dc.contributor.localauthor | Paik, Kyung Wook | - |
| dc.contributor.nonIdAuthor | Lee, Sang Hoon | - |
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