Ultra-Thin Chip-in-Flex (CIF) technology using Anisotropic Conductive Films (ACFs) for Wearable Electronics Applications
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Ji Hye | ko |
| dc.contributor.author | Lee, Tae-Ik | ko |
| dc.contributor.author | Shin, Ji Won | ko |
| dc.contributor.author | Kim, Taek-Soo | ko |
| dc.contributor.author | Paik, Kyung Wook | ko |
| dc.date.accessioned | 2016-04-18T05:50:18Z | - |
| dc.date.available | 2016-04-18T05:50:18Z | - |
| dc.date.created | 2015-11-26 | - |
| dc.date.issued | 2015-10-15 | - |
| dc.identifier.citation | The 14th International Symposium on Microelectronics and Packaging | - |
| dc.identifier.uri | http://hdl.handle.net/10203/204768 | - |
| dc.language | English | - |
| dc.publisher | The Korean Microelectronics and Packaging Society | - |
| dc.title | Ultra-Thin Chip-in-Flex (CIF) technology using Anisotropic Conductive Films (ACFs) for Wearable Electronics Applications | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | The 14th International Symposium on Microelectronics and Packaging | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | KINTEX Hall2, Ilsan | - |
| dc.contributor.localauthor | Kim, Taek-Soo | - |
| dc.contributor.localauthor | Paik, Kyung Wook | - |
| dc.contributor.nonIdAuthor | Kim, Ji Hye | - |
| dc.contributor.nonIdAuthor | Shin, Ji Won | - |
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