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Near-field and far-field analyses of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications

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dc.contributor.authorChoi, Jinwooko
dc.contributor.authorKam, Dong Gunko
dc.contributor.authorChung, Daehyunko
dc.contributor.authorSrinivasan, Krishnako
dc.contributor.authorGovind, Vinuko
dc.contributor.authorKim, Jounghoko
dc.contributor.authorSwaminathan, Madhavanko
dc.date.accessioned2010-11-29T05:09:25Z-
dc.date.available2010-11-29T05:09:25Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2007-05-
dc.identifier.citationIEEE TRANSACTIONS ON ADVANCED PACKAGING, v.30, no.2, pp.180 - 190-
dc.identifier.issn1521-3323-
dc.identifier.urihttp://hdl.handle.net/10203/20465-
dc.description.abstractThis paper presents near-field (NF) and far-field (FF) analysis of alternating impedance electromagnetic bandgap (AI-EBG) structure in packages and boards. Three test vehicles have been designed and fabricated for NF and FF measurements. Simulation results using a full-wave solver (SONNET) have been compared with measurement results. This paper investigates the radiation due to return current on different reference planes. The analysis results from simulations and measurements provide important guidelines for design of the AI-EBG structure based power distribution network for noise isolation and suppression in mixed-signal systems.-
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC-
dc.subjectNOISE-
dc.titleNear-field and far-field analyses of alternating impedance electromagnetic bandgap (AI-EBG) structure for mixed-signal applications-
dc.typeArticle-
dc.identifier.wosid000247090300004-
dc.identifier.scopusid2-s2.0-34249788981-
dc.type.rimsART-
dc.citation.volume30-
dc.citation.issue2-
dc.citation.beginningpage180-
dc.citation.endingpage190-
dc.citation.publicationnameIEEE TRANSACTIONS ON ADVANCED PACKAGING-
dc.identifier.doi10.1109/TADVP.2007.896921-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorChoi, Jinwoo-
dc.contributor.nonIdAuthorKam, Dong Gun-
dc.contributor.nonIdAuthorChung, Daehyun-
dc.contributor.nonIdAuthorSrinivasan, Krishna-
dc.contributor.nonIdAuthorGovind, Vinu-
dc.contributor.nonIdAuthorSwaminathan, Madhavan-
dc.type.journalArticleArticle; Proceedings Paper-
dc.subject.keywordAuthoralternating impedance electromagnetic bandgap (AI-EBG) structure-
dc.subject.keywordAuthorelectromagnetic interference (EMI)-
dc.subject.keywordAuthorfar-field (FF)-
dc.subject.keywordAuthormixed-signal system-
dc.subject.keywordAuthornear-field (NF)-
dc.subject.keywordAuthornoise isolation-
dc.subject.keywordAuthorradiation-
dc.subject.keywordAuthorsignal integrity-
dc.subject.keywordPlusNOISE-
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