Signal and power integrity analysis in 2.5D integrated circuits (ICs) with glass, silicon and organic interposer

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dc.contributor.authorKim, Young Wooko
dc.contributor.authorKim, Ki Yeongko
dc.contributor.authorCho, Jong Hyunko
dc.contributor.authorSundaram, Venkyko
dc.contributor.authorTummala, Raoko
dc.contributor.authorKim, Joung Hoko
dc.date.accessioned2016-04-18T05:14:49Z-
dc.date.available2016-04-18T05:14:49Z-
dc.date.created2015-11-24-
dc.date.created2015-11-24-
dc.date.issued2015-05-28-
dc.identifier.citation65th Electronic Components and Technology Conference (ECTC)-
dc.identifier.urihttp://hdl.handle.net/10203/204496-
dc.languageEnglish-
dc.publisher65th Electronic Components and Technology Conference (ECTC)-
dc.titleSignal and power integrity analysis in 2.5D integrated circuits (ICs) with glass, silicon and organic interposer-
dc.typeConference-
dc.identifier.wosid000370285100112-
dc.identifier.scopusid2-s2.0-84942089899-
dc.type.rimsCONF-
dc.citation.publicationname65th Electronic Components and Technology Conference (ECTC)-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationSheraton San Diego Hotel & Marina-
dc.contributor.localauthorKim, Joung Ho-
dc.contributor.nonIdAuthorSundaram, Venky-
dc.contributor.nonIdAuthorTummala, Rao-
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EE-Conference Papers(학술회의논문)
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