Shielding Structures for Through Silicon Via (TSV) to Active Circuit Noise Coupling in 3D IC

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dc.contributor.authorLim, Jae Minko
dc.contributor.authorLee, Man Hoko
dc.contributor.authorJung, Daniel HYko
dc.contributor.authorKim, Jong Hoonko
dc.contributor.authorChoi, Su Minko
dc.contributor.authorLee, Hyun Sukko
dc.contributor.authorKim, Joung Hoko
dc.date.accessioned2016-04-18T04:46:02Z-
dc.date.available2016-04-18T04:46:02Z-
dc.date.created2015-11-24-
dc.date.issued2015-11-11-
dc.identifier.citation2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO)-
dc.identifier.urihttp://hdl.handle.net/10203/204185-
dc.languageEnglish-
dc.publisher2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO)-
dc.titleShielding Structures for Through Silicon Via (TSV) to Active Circuit Noise Coupling in 3D IC-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationname2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO)-
dc.identifier.conferencecountryUK-
dc.identifier.conferencelocationRugby Stadium, Edinburgh-
dc.contributor.localauthorKim, Joung Ho-
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EE-Conference Papers(학술회의논문)
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