Shielding Structures for Through Silicon Via (TSV) to Active Circuit Noise Coupling in 3D IC
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lim, Jae Min | ko |
| dc.contributor.author | Lee, Man Ho | ko |
| dc.contributor.author | Jung, Daniel HY | ko |
| dc.contributor.author | Kim, Jong Hoon | ko |
| dc.contributor.author | Choi, Su Min | ko |
| dc.contributor.author | Lee, Hyun Suk | ko |
| dc.contributor.author | Kim, Joung Ho | ko |
| dc.date.accessioned | 2016-04-18T04:46:02Z | - |
| dc.date.available | 2016-04-18T04:46:02Z | - |
| dc.date.created | 2015-11-24 | - |
| dc.date.created | 2015-11-24 | - |
| dc.date.created | 2015-11-24 | - |
| dc.date.issued | 2015-11-11 | - |
| dc.identifier.citation | 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO) | - |
| dc.identifier.uri | http://hdl.handle.net/10203/204185 | - |
| dc.language | English | - |
| dc.publisher | 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO) | - |
| dc.title | Shielding Structures for Through Silicon Via (TSV) to Active Circuit Noise Coupling in 3D IC | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000380564800047 | - |
| dc.identifier.scopusid | 2-s2.0-84964053826 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO) | - |
| dc.identifier.conferencecountry | UK | - |
| dc.identifier.conferencelocation | Rugby Stadium, Edinburgh | - |
| dc.contributor.localauthor | Kim, Joung Ho | - |
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