Cu-Ag Core-Shell Nanoparticles as Conductive Ink Material for Printed Electronics Application

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dc.contributor.authorLee, Changsooko
dc.contributor.authorKim, Naraeko
dc.contributor.authorKoo, Jahyunko
dc.contributor.authorLee, Yung Jongko
dc.contributor.authorLee, Hyuck-Moko
dc.date.accessioned2016-04-12T08:34:48Z-
dc.date.available2016-04-12T08:34:48Z-
dc.date.created2015-11-10-
dc.date.issued2015-03-18-
dc.identifier.citation2015 TMS annual meeting(144th)-
dc.identifier.urihttp://hdl.handle.net/10203/203650-
dc.languageEnglish-
dc.publisherThe Minerals, Metals & Materials Society-
dc.titleCu-Ag Core-Shell Nanoparticles as Conductive Ink Material for Printed Electronics Application-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationname2015 TMS annual meeting(144th)-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationWalt Disney World, Orlando-
dc.contributor.localauthorLee, Hyuck-Mo-
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MS-Conference Papers(학술회의논문)
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