Magnetically-Coupled Current Probing Structure Consisting of TSVs and RDLs in 2.5D and 3D Ics
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Joungho | ko |
| dc.contributor.author | Bumhee Bae | ko |
| dc.contributor.author | Sukjin Kim | ko |
| dc.contributor.author | Sunkyu Kong | ko |
| dc.contributor.author | Heegon Kim | ko |
| dc.contributor.author | Daniel H. Jung | ko |
| dc.date.accessioned | 2016-04-12T08:04:22Z | - |
| dc.date.available | 2016-04-12T08:04:22Z | - |
| dc.date.created | 2015-10-06 | - |
| dc.date.created | 2015-10-06 | - |
| dc.date.created | 2015-10-06 | - |
| dc.date.issued | 2014-12-01 | - |
| dc.identifier.citation | IEEE International 3D Systems Integration Conference | - |
| dc.identifier.uri | http://hdl.handle.net/10203/203472 | - |
| dc.language | English | - |
| dc.publisher | IEEE International 3D Systems Integration Conference | - |
| dc.title | Magnetically-Coupled Current Probing Structure Consisting of TSVs and RDLs in 2.5D and 3D Ics | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000412470500010 | - |
| dc.identifier.scopusid | 2-s2.0-84963838619 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | IEEE International 3D Systems Integration Conference | - |
| dc.identifier.conferencecountry | IE | - |
| dc.identifier.conferencelocation | Actons Hotel Kinsale, County Cork | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Bumhee Bae | - |
| dc.contributor.nonIdAuthor | Sukjin Kim | - |
| dc.contributor.nonIdAuthor | Sunkyu Kong | - |
| dc.contributor.nonIdAuthor | Heegon Kim | - |
| dc.contributor.nonIdAuthor | Daniel H. Jung | - |
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