Noise coupling emulation between TSV and active circuit through metal oxide patch

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 235
  • Download : 0
DC FieldValueLanguage
dc.contributor.authorKim, Jounghoko
dc.contributor.authorJonghyun Choko
dc.contributor.authorJaemin Limko
dc.date.accessioned2016-04-12T08:03:17Z-
dc.date.available2016-04-12T08:03:17Z-
dc.date.created2015-10-12-
dc.date.created2015-10-12-
dc.date.issued2015-05-28-
dc.identifier.citation65th Electronic Components and Technology Conference (ECTC)-
dc.identifier.urihttp://hdl.handle.net/10203/203462-
dc.languageEnglish-
dc.publisher65th Electronic Components and Technology Conference (ECTC)-
dc.titleNoise coupling emulation between TSV and active circuit through metal oxide patch-
dc.typeConference-
dc.identifier.wosid000370285100305-
dc.identifier.scopusid2-s2.0-84942104373-
dc.type.rimsCONF-
dc.citation.publicationname65th Electronic Components and Technology Conference (ECTC)-
dc.identifier.conferencecountryUS-
dc.identifier.conferencelocationSheraton San Diego Hotel & Marina-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorJonghyun Cho-
dc.contributor.nonIdAuthorJaemin Lim-
Appears in Collection
EE-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0