Precise RLGC Modeling and Analysis of Through Glass Via (TGV) for 2.5D/3D IC
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Joungho | ko |
| dc.contributor.author | Insu Hwang | ko |
| dc.contributor.author | Youngwoo Kim | ko |
| dc.contributor.author | Jonghyun Cho | ko |
| dc.contributor.author | Venky Sundaram, | ko |
| dc.contributor.author | Rao Tummala | ko |
| dc.date.accessioned | 2016-04-12T08:03:10Z | - |
| dc.date.available | 2016-04-12T08:03:10Z | - |
| dc.date.created | 2015-10-12 | - |
| dc.date.created | 2015-10-12 | - |
| dc.date.created | 2015-10-12 | - |
| dc.date.issued | 2015-05-28 | - |
| dc.identifier.citation | 65th Electronic Components and Technology Conference (ECTC) | - |
| dc.identifier.uri | http://hdl.handle.net/10203/203461 | - |
| dc.language | English | - |
| dc.publisher | 65th Electronic Components and Technology Conference (ECTC) | - |
| dc.title | Precise RLGC Modeling and Analysis of Through Glass Via (TGV) for 2.5D/3D IC | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000370285100040 | - |
| dc.identifier.scopusid | 2-s2.0-84942115506 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 65th Electronic Components and Technology Conference (ECTC) | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Sheraton San Diego Hotel & Marina | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Insu Hwang | - |
| dc.contributor.nonIdAuthor | Youngwoo Kim | - |
| dc.contributor.nonIdAuthor | Jonghyun Cho | - |
| dc.contributor.nonIdAuthor | Venky Sundaram, | - |
| dc.contributor.nonIdAuthor | Rao Tummala | - |
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