Modeling and Analysis of Defects in Through Silicon Via Channel for Non-invasive Fault Isolation
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Joungho | ko |
| dc.contributor.author | Kim, Heegon | ko |
| dc.contributor.author | Kim, Jonghoon J | ko |
| dc.contributor.author | Kim, Sukjin | ko |
| dc.contributor.author | Bae, Hyun-Cheol | ko |
| dc.contributor.author | Choi, Kwang-Seong | ko |
| dc.date.accessioned | 2016-04-12T08:02:31Z | - |
| dc.date.available | 2016-04-12T08:02:31Z | - |
| dc.date.created | 2015-10-12 | - |
| dc.date.created | 2015-10-12 | - |
| dc.date.created | 2015-10-12 | - |
| dc.date.issued | 2015-08-31 | - |
| dc.identifier.citation | IEEE International 3D Systems Integration Conference (3DIC) | - |
| dc.identifier.uri | http://hdl.handle.net/10203/203455 | - |
| dc.language | English | - |
| dc.publisher | IEEE International 3D Systems Integration Conference (3DIC) | - |
| dc.title | Modeling and Analysis of Defects in Through Silicon Via Channel for Non-invasive Fault Isolation | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000377084700051 | - |
| dc.identifier.scopusid | 2-s2.0-84962243442 | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | IEEE International 3D Systems Integration Conference (3DIC) | - |
| dc.identifier.conferencecountry | JA | - |
| dc.identifier.conferencelocation | Sendai, Japan | - |
| dc.contributor.localauthor | Kim, Joungho | - |
| dc.contributor.nonIdAuthor | Kim, Heegon | - |
| dc.contributor.nonIdAuthor | Kim, Jonghoon J | - |
| dc.contributor.nonIdAuthor | Kim, Sukjin | - |
| dc.contributor.nonIdAuthor | Bae, Hyun-Cheol | - |
| dc.contributor.nonIdAuthor | Choi, Kwang-Seong | - |
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