DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Joungho | ko |
dc.contributor.author | Heegon Kim | ko |
dc.contributor.author | Daniel H. Jung | ko |
dc.contributor.author | Jonghoon J. Kim | ko |
dc.contributor.author | Jaemin Lim | ko |
dc.contributor.author | Hyunsuk Lee | ko |
dc.contributor.author | Kyungjun Cho | ko |
dc.contributor.author | Hyungsoo Kim | ko |
dc.contributor.author | Yongju Kim | ko |
dc.contributor.author | Yunsaing Kim | ko |
dc.date.accessioned | 2016-04-12T08:02:25Z | - |
dc.date.available | 2016-04-12T08:02:25Z | - |
dc.date.created | 2015-10-12 | - |
dc.date.created | 2015-10-12 | - |
dc.date.created | 2015-10-12 | - |
dc.date.issued | 2015-08-31 | - |
dc.identifier.citation | IEEE International 3D Systems Integration Conference (3DIC) | - |
dc.identifier.uri | http://hdl.handle.net/10203/203454 | - |
dc.language | English | - |
dc.publisher | IEEE International 3D Systems Integration Conference (3DIC) | - |
dc.title | Crosstalk-Included Eye-Diagram Estimation for High-speed Silicon, Organic, and Glass Interposer Channels on 2.5D/3D IC | - |
dc.type | Conference | - |
dc.identifier.wosid | 000377084700047 | - |
dc.identifier.scopusid | 2-s2.0-84962311529 | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | IEEE International 3D Systems Integration Conference (3DIC) | - |
dc.identifier.conferencecountry | JA | - |
dc.identifier.conferencelocation | Sendai, Japan | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Heegon Kim | - |
dc.contributor.nonIdAuthor | Daniel H. Jung | - |
dc.contributor.nonIdAuthor | Jonghoon J. Kim | - |
dc.contributor.nonIdAuthor | Jaemin Lim | - |
dc.contributor.nonIdAuthor | Hyunsuk Lee | - |
dc.contributor.nonIdAuthor | Kyungjun Cho | - |
dc.contributor.nonIdAuthor | Hyungsoo Kim | - |
dc.contributor.nonIdAuthor | Yongju Kim | - |
dc.contributor.nonIdAuthor | Yunsaing Kim | - |
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