Browse "RIMS Conference Papers" by Title 

Showing results 601 to 620 of 3515

601
Asymmetric Disappearance and Periodic Asymmetric Phenomena of Rocking Dynamics in Micro Dual-capacitive Energy Harvester

Zhu, Jiaxiong; Guo, Xiaoyu; Huang, Run, 2nd International Conference on Materials Science, Energy Technology, Power Engineering (MEP), AMER INST PHYSICS, 2018-04

602
Asymptotic Geometry

임진환, TGRC, pp.175 - 184, 1997

603
Asymptotic performance analysis of DOA estimation method for an incoherently distributed source

Lee J.; Sang D.W.; Joung J., Military Communications Conference, MILCOM 2007, 2007-10-29

604
ATCam: 공공편의시설 접근성 및 사용성의 실제적 향상을 위한 심층신경망 기반 장애인 고충 탐지 모델 및 중재 제공기법

이재현; 가현욱; 서경덕, 2022 한국컴퓨터종합학술대회, pp.1785 - 1787, 한국정보과학회, 2022-07-01

605
ATM Traffic Characteristics by JPEG Image Compression

Kim, B. g.; Choi MunKee, Asia-Pacific Conference on Communications 1993, v.2, no.2, IEEE, 1993-01

606
ATM Virtual Path Self-Healing Based on a New Path Restoration Protocol

Jae-In Kim, IEEE GLOBECOM, pp.794 - 798, 1994

607
ATM 망에서의 우선순위 제어방식의 성능분석

신병철, 대한전자공학회 하계 종합학술대회, pp.58 - 62, 1993

608
Atomic layer deposited IrO-TiO thin film resistor for the thermal inkjet printheads

Kwon S.H.; Kirn S.W.; Jeong S.J.; Kim K.H.; Kang S.W., Atomic Layer Deposition Applications 4 - 214th ECS Meeting, pp.315 - 319, 123, 2008-10-13

609
Atomic layer deposition of copper thin film using Cu II(diketoiminate)2 and H2

Han B.; Parka K.-M.; Park K.; Park J.-W.; Lee W.-J., 2009 IEEE International Interconnect Technology Conference, IITC 2009, pp.173 - 174, 2009-06-01

610
Atomic page update methods for OpenMP-aware software DSM

Kee Y.-S.; Kim J.-S.; Jeun W.-C.; Ha S., Porceedings - 12th Euromicro Conference on Parallel, Distrubeted and Network-based Proceedings, PDP 2004, pp.144 - 151, 2004-02-11

611
Atomic-Scale Observation of Pre-melting of Ruddlesden-Popper Faults in Perovskite System

안지상, 2022 한국세라믹학회 춘계학술대회, 한국세라믹학회, 2022-04-14

612
Attack-driven Test Case Generation Approach using Model-checking Technique for Collaborating Systems

Mihret,Zelalem; Liu,Lingjun, 2nd IEEE/ACM International Workshop on Engineering and Cybersecurity of Critical Systems, EnCyCriS 2021, pp.1 - 8, Institute of Electrical and Electronics Engineers Inc., 2021-06

613
Attention-Augmented Electromagnetic Representation of Sign Language for Human-Computer Interaction in Deaf-and-Mute Community

Lan, Shengchang; Ye, Linting; Zhang, Kang, 2021 IEEE USNC-URSI Radio Science Meeting (Joint with AP-S Symposium), USNC-URSI 2021, pp.47 - 48, Institute of Electrical and Electronics Engineers Inc., 2021-12

614
Attribution Preservation in Network Compression for Reliable Network Interpretation

Park, GeonDo; Yang, June Yong; Hwang, Sung Ju; Yang, Eunho, Advances in Neural Information Processing Systems, NeurIPS 2020, Neural Information Processing Systems, 2020-12-07

615
Augment Approach to BIS based on DSRC: Using Ubiquitous Computing in Public Transport System

Park, Sang Chan, AIE&M, pp.14 - 14, 2006

616
Augmented reality window: Digital reconstruction of a historical and cultural site for smart phones

Kang J.; Ryu J.-H., 9th IEEE International Symposium on Mixed and Augmented Reality 2010: Arts, Media, and Humanities, ISMAR-AMH 2010, pp.67 - 68, 2010-10-13

617
Augmenting Imbalanced Time-series Data via Adversarial Perturbation in Latent Space

Kim, Beomsoo; Choi, Jang-Ho; Choo, Jaegul, The 13th Asian Conference on Machine Learning, ACML 2021, ACML, 2021-11-17

618
Australians and Canadians at the Cavendish Laboratory in the Early 20th Century

Kim, Dong-Won, 4th British-North American Joint Meeting of BSHS, CSHPS, and HSS, pp.49, Fourth British North American Joint Meeting of the BSHS, CSHPS, and HSS, 2000-08

619
Authentication on public terminals with private devices

Bianchi A., 5th International Conference on Tangible Embedded and Embodied Interaction, TEI'11, pp.429 - 430, 2011-01-23

620
Auto charging platform and algorithms for long-distance flight of drones

Woo, Chungki; Kang, Sanha; Ko, Hojin; Song, Hochan; Kwon, Jae Ook, 2017 IEEE International Conference on Consumer Electronics, ICCE 2017, pp.186 - 187, Institute of Electrical and Electronics Engineers Inc., 2017-01

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