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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Effects of the annealing in Ar and H-2/Ar ambients on the microstructure and the electrical resistivity of the copper film prepared by chemical vapor deposition Rha, SK; Lee, WJ; Lee, SY; Kim, DW; Park, Chong-Ook; Chun , Soung Soon, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.35, no.11, pp.5781 - 5786, 1996-11 | |
| Copper chemical vapour deposition using copper(I) hexafluoroacetylacetonate trimethylvinylsilane Lee, WJ; Min, JS; Rha, SK; Chun , Soung Soon; Park, Chong-Ook; Kim, DW, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.7, no.2, pp.111 - 117, 1996-04 | |
| EFFECTS OF DEPOSITION TEMPERATURE AND ANNEALING PROCESS ON THE SUPERCONDUCTING PROPERTIES OF YBA2CU3O7-X THIN-FILMS PREPARED BY METAL ORGANIC-CHEMICAL VAPOR-DEPOSITION KIM, SH; Cho, CH; Kim, DW; No, Kwangsoo; Chun , Soung Soon, THIN SOLID FILMS, v.214, no.2, pp.229 - 234, 1992-07 |
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