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Results 1-8 of 8 (Search time: 0.005 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
Effects of the annealing in Ar and H-2/Ar ambients on the microstructure and the electrical resistivity of the copper film prepared by chemical vapor deposition

Rha, SK; Lee, WJ; Lee, SY; Kim, DW; Park, Chong-Ookresearcher; Chun , Soung Soonresearcher, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.35, no.11, pp.5781 - 5786, 1996-11

2
Copper chemical vapour deposition using copper(I) hexafluoroacetylacetonate trimethylvinylsilane

Lee, WJ; Min, JS; Rha, SK; Chun , Soung Soonresearcher; Park, Chong-Ookresearcher; Kim, DW, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.7, no.2, pp.111 - 117, 1996-04

3
THE ADHESION OF LOW-PRESSURE CHEMICALLY VAPOR-DEPOSITED TUNGSTEN FILMS ON SILICON AND SIO2 FOR SIH4-H2-WF6 AND H2-WF6 PROCESSES

PARK, YW; Park, Chong-Ookresearcher; Chun , Soung Soonresearcher, THIN SOLID FILMS, v.201, no.1, pp.167 - 175, 1991-06

4
EFFECTS OF DEPOSITION RATE ON THE ENCROACHMENT IN TUNGSTEN FILMS REDUCED BY H-2

PARK, YW; KIM, IL; Park, Chong-Ookresearcher; Chun , Soung Soonresearcher, JOURNAL OF MATERIALS SCIENCE, v.26, no.19, pp.5318 - 5322, 1991-10

5
LOW-PRESSURE CHEMICAL VAPOR-DEPOSITION OF BLANKET TUNGSTEN USING A GASEOUS MIXTURE OF WF6, SIH4, AND H2

PARK, HL; YOON, SS; Park, Chong-Ookresearcher; Chun , Soung Soonresearcher, THIN SOLID FILMS, v.181, no.1, pp.85 - 93, 1989-12

6
Improved Copper chemical vapor deposition process by applying substrate bias

Lee, Won-Jun; Chun , Soung Soonresearcher; Rha, Sa-Kyun; Lee, Seung-Yun; Kim, Dong-Won; Park, Chong-Ook, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.427, pp.207 - 212, 1996

7
Chemical vapor deposition of titanium carbide on AlSl M2 tool steels and Si3N4-TiC ceramic composite

Kang, C.J.; Kim, D.W.; Park, Chong-Ookresearcher; Chun , Soung Soonresearcher, MATERIALS AND MANUFACTURING PROCESSES, v.5, no.1, pp.63 - 78, 1990

8
THE EFFECTS OF DEPOSITION TEMPERATURE ON THE INTERFACIAL PROPERTIES OF SIH4 REDUCED BLANKET TUNGSTEN ON TIN GLUE LAYER

LEE, YJ; Park, Chong-Ookresearcher; KIM, DW; Chun , Soung Soonresearcher, JOURNAL OF ELECTRONIC MATERIALS, v.23, no.10, pp.1075 - 1080, 1994-10

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