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NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
THE EFFECTS OF DEPOSITION TEMPERATURE ON THE INTERFACIAL PROPERTIES OF SIH4 REDUCED BLANKET TUNGSTEN ON TIN GLUE LAYER

LEE, YJ; Park, Chong-Ookresearcher; KIM, DW; Chun , Soung Soonresearcher, JOURNAL OF ELECTRONIC MATERIALS, v.23, no.10, pp.1075 - 1080, 1994-10

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