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NO	Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1	THE EFFECTS OF DEPOSITION TEMPERATURE ON THE INTERFACIAL PROPERTIES OF SIH4 REDUCED BLANKET TUNGSTEN ON TIN GLUE LAYER LEE, YJ; Park, Chong-Ook; KIM, DW; Chun , Soung Soon, JOURNAL OF ELECTRONIC MATERIALS, v.23, no.10, pp.1075 - 1080, 1994-10
2	TIC AND TIN COATINGS FORMED ON SI3N4-TIC COMPOSITE CERAMICS BY CHEMICAL VAPOUR-DEPOSITION KIM, DW; PARK, YJ; LEE, JG; Chun , Soung Soon, THIN SOLID FILMS, v.165, no.1, pp.149 - 161, 1988-11

Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)

LEE, YJ; Park, Chong-Ook; KIM, DW; Chun , Soung Soon, JOURNAL OF ELECTRONIC MATERIALS, v.23, no.10, pp.1075 - 1080, 1994-10

KIM, DW; PARK, YJ; LEE, JG; Chun , Soung Soon, THIN SOLID FILMS, v.165, no.1, pp.149 - 161, 1988-11

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