Showing results 1 to 5 of 5
3-D construction of monolithic passive components for RF and microwave ICs using thick-metal surface micromachining technology Yoon, Jun-Bo; Kim, BI; Choi, YS; Yoon, E, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.51, no.1, pp.279 - 288, 2003-01 |
40 GHz Vertical Transition with a Dual-Mode Cavity for a Low-Temperature Co-fired Ceramic Transceiver Module![]() Byun W.J.; Kim B.S.; Kim K.S.; Eun K.C.; Song M.S.; Kulke R.; Kersten O.; et al, ETRI JOURNAL, v.32, no.2, pp.195 - 203, 2010 |
Low-Jitter Digital Timing Recovery Techniques for CAP-Based VDSL Applications y. song; b. kim, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.38, no.10, pp.1649 - 1656, 2003-10 |
Miniaturised double-coaxial cavity resonator and duplexer with ZOR characteristic using air-core coils Kim, K. S.; Kim, C. Y.; Kim, D. O.; Park, J. G.; Koo, B. H.; Lee, C. H., ELECTRONICS LETTERS, v.49, no.22, pp.1393 - 1394, 2013-10 |
Surface-modified polymer nanofiber membrane for high-efficiency microdust capturing Kim, Han-Jung; Park, Seon Joo; Park, Chul Soon; Le, Thanh-Hai; Lee, Sang Hun; Ha, Tai Hwan; Kim, Hyoung-il; et al, CHEMICAL ENGINEERING JOURNAL, v.339, pp.204 - 213, 2018-05 |
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