플렉시블 전자기기 응용을 위한 미세 솔더 범프 접합부에 관한 연구Study on Joint of Micro Solder Bump for Application of Flexible Electronics
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 고용호 | ko |
| dc.contributor.author | 김민수 | ko |
| dc.contributor.author | 김택수 | ko |
| dc.contributor.author | 방정환 | ko |
| dc.contributor.author | 이창우 | ko |
| dc.date.accessioned | 2015-11-20T12:38:03Z | - |
| dc.date.available | 2015-11-20T12:38:03Z | - |
| dc.date.created | 2013-11-11 | - |
| dc.date.created | 2013-11-11 | - |
| dc.date.issued | 2013-06 | - |
| dc.identifier.citation | 대한용접접합학회지, v.31, no.3, pp.4 - 10 | - |
| dc.identifier.issn | 1225-6153 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/201601 | - |
| dc.language | Korean | - |
| dc.publisher | 대한용접접합학회 | - |
| dc.title | 플렉시블 전자기기 응용을 위한 미세 솔더 범프 접합부에 관한 연구 | - |
| dc.title.alternative | Study on Joint of Micro Solder Bump for Application of Flexible Electronics | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 31 | - |
| dc.citation.issue | 3 | - |
| dc.citation.beginningpage | 4 | - |
| dc.citation.endingpage | 10 | - |
| dc.citation.publicationname | 대한용접접합학회지 | - |
| dc.identifier.kciid | ART001782913 | - |
| dc.contributor.localauthor | 김택수 | - |
| dc.contributor.nonIdAuthor | 고용호 | - |
| dc.contributor.nonIdAuthor | 김민수 | - |
| dc.contributor.nonIdAuthor | 방정환 | - |
| dc.contributor.nonIdAuthor | 이창우 | - |
| dc.subject.keywordAuthor | Bonding technology | - |
| dc.subject.keywordAuthor | Reliability | - |
| dc.subject.keywordAuthor | micro solder bump | - |
| dc.subject.keywordAuthor | Flexible substrate | - |
| dc.subject.keywordAuthor | Die shear test | - |
| dc.subject.keywordAuthor | Thermal shock test | - |
| dc.subject.keywordAuthor | Bending test | - |
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