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Enlarged tensile strain at edge of flexible substrate due to anticlastic curvature Jo, Woosung; Lee, Tae-Ik; Kim, Taek-Soo, MICROELECTRONICS RELIABILITY, v.130, 2022-03 |
Mechanical properties and reliability of advanced energy/electronic materials = 차세대 에너지/전자 재료의 기계적 물성 및 신뢰성 평가link Kim, Jae-Han; 김재한; et al, 한국과학기술원, 2017 |
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