Showing results 1 to 4 of 4
Advanced Cu/Polymer Hybrid Bonding System for Fine-Pitch 3D Stacking Devices Park, Juseong; Kang, Sukkyung; Kim, Myeong Eun; Kim, Nam Jun; Kim, Jungkyun; Kim, Sanha; Kim, Kyung Min, ADVANCED MATERIALS TECHNOLOGIES, v.8, no.20, 2023-10 |
Flexural and tensile moduli of flexible FR4 substrates Lee, Tae-Ik; Kim, Cheolgyu; Kim, Min Sung; Kim, Taek-Soo, POLYMER TESTING, v.53, pp.70 - 76, 2016-08 |
Influence of chemically and plasma-functionalized carbon nanotubes on high-performance polymeric nanocomposites Ajeesh, G; Bhowmik, Shantanu; Venugopal, Sivakumar; Varshney, Lalit; Baluch, Abrar; Park, Yurim; Gilsang, Son; et al, HIGH PERFORMANCE POLYMERS, v.28, no.5, pp.570 - 580, 2016-06 |
Two-layered electromagnetic wave-absorbing E-glass/epoxy plain weave composites containing carbon nanofibers and NiFe particles Park, Ki-Yeon; Han, Jae-Hung; Kim, Jin-Bong; Lee, Sang-Kwan, JOURNAL OF COMPOSITE MATERIALS, v.45, no.26, pp.2773 - 2781, 2011-12 |
Discover