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Effect of high glass transition temperature on reliability of Non-Conductive Film (NCF) Park, JH; Chung, CK; Paik, KW; Lee, Soon-Bok, International Confernce on Experimental Mechanics, 2006, v.326-328 I, pp.517 - 520, 2006 |
Experimental analysis on the mechanism of moisture induced interface weakening in ACF package Sim, Gidong; Chung, CK; Paik, KW; Lee, Soon-Bok, European Microelectronics and Packaging Conference, EMPC 2009, European Microelectronics and Packaging Conference, EMPC 2009, 2009-06-15 |
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