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Reduction of fabricational thermal residual stress of the hybrid co-cured structure using a dielectrometry Kim, HS; Lee, Dai Gil, COMPOSITES SCIENCE AND TECHNOLOGY, v.67, pp.29 - 44, 2007-01 |
Smart cure cycle with cooling and reheating for co-cure bonded steel/carbon epoxy composite hybrid structures for reducing thermal residual stress Kim, Hak Sung; Park, Sang Wook; Lee, Dai Gil, COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, v.37, no.10, pp.1708 - 1721, 2006 |
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